| Corporate summary |
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| Trade Name |
: |
KYOCERA Chemical Corporation |
| Headquarters |
: |
5-14-25 Ryoke, Kawaguchi, Saitama 332-8533
Tel:+81-(0)48-225-6834(Rep) |
| Established |
: |
October 1, 1974 (Toshiba Chemical Corporation)
Since August 1, 2002, our corporate name has been changed to "KYOCERA Chemical Corporation". |
President and
Representative
Director |
: |
Yasunobu Kawae |
| Capital |
: |
10,172 million yen |
| Employees (Groupe) |
: |
900 (as of the end of March, 2009) |
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| Business Description |
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| Materials: |
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Molding Compounds for Semiconductor Encapsulation
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ex: |
Epoxy Molding Compounds for Semiconductor Encapsulating |
Molding Compounds
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ex: |
Phenolic Molding Compounds / Epoxy Molding Compounds / Unsaturated Polyester Molding Compounds / Thermosetting Polyimide Resin |
Functional Materials
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ex: |
Electric Conductive Pastes / Anisotropic Conductive Pastes / Heat-Resistance Passivation Materials |
Chemical Engineering Materials
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ex: |
Insulating Varnishes / Casting Resin |
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| Components and Instruments: |
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Printed Circuit Board Materials
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ex: |
Flexible Printed Circuit (FPC) Materials / Thermosetting PPE Printed Circuits Board Materials |
Molded Products
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ex: |
Magnesium-Molded Parts / Thermoplastic Molded Parts / Thermosetting Molded Parts / CFRP,GFRP Pultrusion Molded Parts / TC Boards |
Molding Dies
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ex: |
Molding Dies for Components of Automobiles and Household Appliances / Molding Dies with Mechanism |
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| Related info |
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