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News Release > Perfect Green Molding Compounds for Automotive Devices 
The news releases herein are released for a media organization, and are current of the date of publication.

- Flame Retardant-free Semiconductor Encapsulant -
Excellent Long Term Heat Resistance and Thermal Cycle Reliability -

Perfect Green Molding Compounds for Automotive Devices
February 4, 2005

KYOCERA Chemical Corporation (KYOCERA Chemical) developed Flame Retardant-free Semiconductor Encapuslant, having long-term heat resistance and reliability, for Automotive applications.

KYOCERA Chemical has researched and developed environmental friendly molding compounds without any hazardous flame retardant, like haloids and antimony derivatives, for years. For automotive devices, KYOCERA Chemical just developed Perfect Green Molding compounds, which didn't contain any alternative flame retardant, like phosphine compound, with excellent heat resistance and thermal cycle reliability. KYOCERA Chemical Perfect Green Compounds enable our customers to achieve Pb free soldering and excellent reliability (long term high temperature storage life, 'HTSL' and thermal cycle test, TCT). Our new compounds are especially expected to be qualified for automotive semiconductor devices, which require robust reliability.

Nowadays, the requirement of elimination of hazardous substances, like haloids, antimony and lead, in molding compounds for semiconductor becomes common.
KYOCERA Chemical has been studied "Oxygen Index" of molding compounds, which is one of parameter to show inflammability. We remarked (1) molecular structure of matrix resin and (2) high filler loading in molding compounds. Finally, we succeeded to eliminate any alternative flame retardant from molding compounds, maintaining good flame retardancy. The new compounds brought excellent high temperature reliability as well as environmental friendliness.


<Perfect Green Molding Compounds for Automotive Devices>

The Perfect Green Molding Compounds contain high proportion of high-grade silica filler. Ratio-optimization of matrix resin makes gap of each polymer-chain narrow. Additionally, elimination of flame retardant, which may isolate ionic impurity, yields high reliability during high temperature storage life test (HTSL) and thermal cycle test (TCT). They are essential reliability test for automotive device, no less than pressure cooker test (PCT).
For example, devices, molded with the new compounds, show no failure after long term HTSL test at 175 degree C.

From this advantage, qualifications in many automotive semiconductor suppliers are on going. And we have started mass production for some customers.
KYOCERA Chemical Perfect Green Compounds are manufactured at Kooriyama Plant in Japan and KYOCERA Chemical Singapore Pte.Ltd. in Singapore.

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News Release > Perfect Green Molding Compounds for Automotive Devices 
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