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KYOCERA Corporation
Products > Applications > Office Automation Equipments  Japanese

Office Automation Equipments

Office Automation Equipments

 Molding Compounds for Semiconductor Encapsulation
Molding Compounds for Laminate Packages
Used for memory card.
  Molding Compounds for Surface Mount Devices : Environmental Friendly type
It can achieve level 1 of JEDEC because of it's high reliability.
  Molding Compounds for Surface Mount Devices : Standard(Br/Sb) type
It is easy to mold. And It can use high temperature reflow process.
         
Molding Compounds for Small Signal Packages
It is easy to mold. We provide extra small type and pin insertion type.
  Molding Compounds for General Packages : Standard Low Stress type
It is easy to mold. It is good for large size LSI.
  Molding Compounds for General Packages : High Tg and Low Stress type
It is good for module.
         
Molding Compounds for General Packages : Environment Friendly type
We manufacture flame resistant-free materials.
  Molding Compounds for Power Devices
It is good for requirement of heat radiation.
 

 Molding Compounds
Advanced Phenol Molding Compounds
It has good performance about insulating and mechanical strength.
  Standard Insulating Materials
It has good balance about insulating, strength, and molding.
  Rapid Cure Insulating Materials
It has very good characteristic aboutStrength, Dimension, Molding, and cost performance.
         
Heat-Resistance Materials
It is good materials for requirement of reliability.
  Impact Resistance Materials
It has good characteristic about impact resistance.
  Ammonia-Free Materials
Our ammonia-free materials have excellent causticity.
         
High Strength Materials
It has very good characteristic about mechanical strength, dimension, and molding.
  Super Heat-Resistance Materials
Ideal material for substitution of metal parts, in applications above 200°C.
  Injection Molding Epoxy Compounds for Highly Precision Materials
It is injection molding materials for precise dimension.
         
Premix for Molding
It has high reliability about moisture resistance,rust prevention, corrosion resistance, low noise, and long life.
  Premix for High Precision Molding Parts
It has very good characteristic for precision component.
  Premix for Electric Parts
It has good balanced premix material about electric characteristic and mechanical strength.
         
Premix for Special Purpose
Fixer for grinding whetstone.
  Premix for Light Weight
Low specific gravity(1.0 to 1.6). And good mechanical strength.
   

 Functional Materials
Electric Conductive Pastes for General use
It can be used for IC chip joint.
  High Thermal Conductive Pastes
It can be used for power IC for PC.
  Electric Conductive Pastes for Pb-Free
It can use high temperature reflow process. And it can be used for IC chip joint.
         
Pastes for Flip Chip Assembly use
We provide materials for fast stiffening and low out gas.
  Eutectic Joint Applicable NCP
It can be used for LCD driver IC.
   

 Printed Circuit Board Materials
Super Bonding Sheet
It is powder-free type bonding sheet. It has good handling.
  Heat-Resistance Halogen-free FPC Materials : Flexible Copper Clad Laminate
It is flexible copper clad laminate with heatproof in two layer opposition FPC.
  Heat-Resistance Halogen-free FPC Materials : Coverlay (Cover Film)
It can achieve high level insulation same as rigid circuit board.
         
Heat-Resistance Halogen-free FPC Materials : Bonding Sheet
It has high level heat proof. And It is good for multi- layered ZFPC and COF.
  FPC Materials : Flexible Copper Clad Laminate
It is Poly-imide flexible copper clad laminate with high level flexibility.
  FPC Materials : Coverlay (Cover Film)
It is Coverlay film based on Poly-Imide film.
         
FPC Materials : Bonding Sheet
It is bonding sheet that can be used for FPC and stiffener sheet.
       

 Chemical Engineering Materials
Non-Solvent Type Varnishes
It is low temperature and fast stiffening type product. It can be used as insulation for various electric parts for consumer electronic.
  Solvent Type Varnishes
It has good handling characteristics, and it is widely used for insulation purposes.
  Inflammable Resins for High Voltage Trans
It is good for high voltage transformer.
         
Electrical / Electronic Parts Application Resins
It is good for parts for LCD monitor.
       

 Molded Products
Magnesium-Molded Parts
We have top class technology about molding for large and thin molded parts.
  Plastic Molded Parts
We get a good reputation about Electronic equipment.
  TC Boards : Heat Resistant type
This board has good characteristic of trucking, ark resistance, burning resistance, heatproof, size stability, and acid heating.
         
TC Boards : High Heat Resistant type
We provide high grade heatproof TC board for various electronic equipment and structure material.
  TC Boards : High Strength, Heat Resistant
We provide extra high strength TC board for various electronic equipment and structure material.
  TC Boards : Acid Resistant, Heat Resistant
We provide high acidity and seawater resistance TC board for various electronic equipment and structure material.
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 Related info
Molding Compounds for Semiconductor Encapsulation
Molding Compounds
Functional Materials
Printed Circuit Board Materials
Chemical Engineering Materials
Molded Products
Molding Dies
   
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