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Products > Applications > Office Automation Equipment	Japanese
Office Automation Equipment

Molding Compounds for Semiconductor Encapsulation


Molding Compounds for Laminate Packages Used for memory cards.	Molding Compounds for Surface Mount Devices: Environmentally Friendly Type Passed level 1 of JEDEC due to its high reliability.	Molding Compounds for Surface Mount Devices: Standard (Br/Sb) Type Easy to mold. Can use high temperature reflow process

Molding Compounds for Small Signal Packages Easy to mold. We provide extra small type and pin insertion types.	Molding Compounds for General Packages: Standard Low Stress Type Easy to mold. Good for large size LSI.	Molding Compounds for General Packages: High Tg and Low Stress Type Good for modules.

Molding Compounds for General Packages: Environmentally Friendly Type We manufacture flame-resistant-free materials.	Molding Compounds for Power Devices Good for heat radiation requirements.

Molding Compounds


Advanced Phenol Molding Compounds Possess good insulation and mechanical strength performance.	Standard Insulating Materials Possess good balance of insulation, strength, and molding.	Rapid Cure Insulating Materials Possess very good strength, dimension, molding, and cost performance characteristics.

Heat-Resistant Materials Highly reliable materials.	Impact-Resistant Materials Possess good impact resistance characteristics.	Ammonia-Free Materials Our ammonia-free materials have excellent causticity.

High-Strength Materials Possess very good mechanical strength, dimension and molding characteristics.	Super Heat-Resistant Materials Ideal material for substitution of metal parts in applications above 200°C.	Injection Molding Epoxy Compounds for Highly Precision Materials Injection molding materials for precise dimensions.

Premix for Molding Possesses high reliability in moisture resistance, rust prevention, corrosion resistance, low noise and long life.	Premix for High Precision Molding Parts Possesses very good characteristics for precision components.	Premix for Electric Parts Balanced premix material with good electric characteristics and mechanical strength.

Special Purpose Premix Fixer for grinding whetstones.	Premix for Light Weight Possesses low specific gravity (1.0 to 1.6) and good mechanical strength.

Functional Materials


Electric Conductive Pastes for General use Can be used for IC chips joints.	High Thermal Conductive Pastes Can be used for power ICs for PCs.	Electric Conductive Pastes for Pb-Free Can use high temperature reflow process, and be used for IC chip joints.

Pastes for Flip Chip Assembly use We provide materials for fast stiffening and low out gas.	Eutectic Joint Applicable NCP Can be used for LCD driver ICs.

Printed Circuit Board Materials


Heat-Resistant Halogen-Free FPC Materials: Flexible Copper Clad Laminates Flexible, heatproof copper clad laminates in two-layer opposition FPC.	Heat-Resistant Halogen-Free FPC Materials: Coverlays (Cover Films) Achieve high level insulation equivalent to rigid circuit boards.	Heat-Resistant Halogen-Free FPC Materials: Bonding Sheets Possess high level heat resistance and is good for multi- layered ZFPCs and COFs.

FPC Materials: Flexible Copper Clad Laminates Polyimide flexible copper clad laminates with high level flexibility.	FPC Materials: Coverlays (Cover Films) Coverlay films based on polyimide film.	FPC Materials: Bonding Sheets Bonding sheets that can be used for FPCs and stiffener sheets.

Chemically Engineered Materials


Non-Solvent Type Varnishes Low temperature and fast hardening. Can be used as insulation for various electric parts in consumer electronics.	Solvent Type Varnishes Possess good handling characteristics, and is widely used for insulation purposes.	Inflammable Resins for High Voltage Trans Good for high voltage transformers.

Electrical / Electronic Parts Application Resins Good for parts for LCD monitors.

Molded Products


Magnesium-Molded Parts We have world-class molding technology for large and thin molded parts.	Plastic Molded Parts We have earned a good reputation for electronic equipment.	TC Boards: Heat-Resistant Type This board has good characteristics for trucking, ark resistance, burning resistance, heatproof, size stability and acid heating.

TC Boards: Highly Heat-Resistant Type We provide high grade heatproof TC boards for various electronic equipment and structural materials.	TC Boards: High Strength, Heat-Resistant We provide extra high strength TC boards for various electronic equipment and structural materials.	TC Boards: Acid-Resistant, Heat-Resistant We provide high acidity and seawater-resistant TC boards for various electronic equipment and structural materials.

Related Information


	Molding Compounds for Semiconductor Encapsulation
	Molding Compounds
	Functional Materials
	Printed Circuit Board Materials
	Chemically Engineered Materials
	Molded Products
	Molding Dies

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