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KYOCERA Corporation
Products > Applications > Automobile Parts  Japanese

Automobile Parts

 
Automobile Parts
 Molding Compounds for Semiconductor Encapsulation
Molding Compounds for Laminate Packages
Used for memory card. No harmful substances when dicing after molding.
  Molding Compounds for Surface Mount Devices : Environmental Friendly type
It can achieve level 1 of JEDEC because of it's high reliability.
  Molding Compounds for Surface Mount Devices : Standard(Br/Sb) type
It has good moldability. And It can use high temperature reflow process.
         
Molding Compounds for Small Signal Packages
It has good moldability. We provide extra small type and pin insertion type.
  Molding Compounds for General Packages : Standard Low Stress type
It has good moldability. It is good for large size LSI.
  Molding Compounds for General Packages : High Tg and Low Stress type
It is good for module.
         
Molding Compounds for General Packages : Environment Friendly type
We prepare flame resistant-free materials.
  Molding Compounds for Power Devices
It is good for requirement of heat radiation.
 
         
 Molding Compounds
Rapid Cure General Purpose Molding Compounds
It has very good characteristic about Strength, Dimension, Moldability, and cost performance.
  High Strength Molding Compounds
It has very good characteristic about mechanical strength, dimension, and moldability.
  Super Heat-Resistance Molding Compounds
Ideal material for substitution of metal parts, in applications above 200°C.
         
Premix for Molding
Down sizing can be done. Moisture resistance, low noise, reliance will be improved.
  Premix for High Precision Molding Parts
It has very good characteristic for precision component.
  Premix for Electric Parts
It has good balanced premix material about electric characteristic and mechanical strength.
         
Premix for Special Purpose
Fixer for grinding whetstone.
  Premix for Light Weight
Low specific gravity(1.0 to 1.6). And good mechanical strength.
   
         
 Functional Materials
Electric Conductive Pastes for General use
It can be used for electrical components of car interior.
  High Thermal Conductive Pastes
These absorption ratio is low. It is good for car application.
  Electric Conductive Pastes for Pb-Free
It can use high temperature reflow process.
         
Photo-Sensitive Passivation Materials for Wafer-Coating
It can make resin pattern with high heat resistance.
  Heat-Resistance Poly-Imide Resin for Wafer-Coating
This poly-imide resin is excellent in the moisture resistance and bonding.
   
         
 Printed Circuit Board Materials
Super Flexible Copper Clad
It is flexible copper clad laminate with stability of dimension and heatproof.
  Super Bonding Sheet
It has good handling and good bonding performance.
  Heat-Resistance Halogen-free FPC Materials : Flexible Copper Clad Laminate
It has high heat-resistance.
         
Heat-Resistance Halogen-free FPC Materials : Coverlay (Cover Film)
It FPC material with heat-resistance and high reliability of insulation.
  Heat-Resistance Halogen-free FPC Heat-Resistance Halogen-free FPC Materials : Bonding Sheet
It has high heat-resistance and stable bonding performance.
  FPC Materials : Flexible Copper Clad Laminate
It is Flexible Copper Clad Laminate based on Poly-Imide film.
         
FPC Materials : Coverlay (Cover Film)
It is Coverlay film based on Poly-Imide film.
  FPC Materials : Bonding Sheet
It is multi-purpose adhesive resin on the sheet.
   
         
 Chemical Engineering Materials
Non-Solvent Type Varnishes
We have a experience about Alternator and starter on the car already. Clinging power is kept in high temperature.
  Casting Resin for Ignition Coil
We have a lot of experience about insulating materials for ignition coil.
  Electrical / Electronic Parts Application Resins
It is good for encapsulation of sensor and etc. Because it is low stress and has flexibility.
         
 Molded Products
Magnesium-Molded Parts
We have top class technology about molding for large and thin molded parts.
  Plastic Molded Parts
We get a good reputation about Electronic equipment.
  Unsaturated Polyester Molded Parts (Premix Molded Parts)
NEW!
It is used in wide fields, for example small electric component, large structure, and so on.
         
Phenolic Molded Parts
NEW!
It is used in wide fields, for example electric components, car molding parts, and so on.
  Epoxy Molded Parts
NEW!
It is used in wide fields that required high reliability for example the parts for electric device.
  GFRP
The cost was made cheap by using the glass. It is pultrusion molded parts with high strength and nonconductivity.
         
CFRP
It is pultrusion molded part with stable dimension , specific strength, light weight, and high elasticity.
       
         
 Molding Dies
Molding Dies for Components of Automobiles
We produce injection molding dies for any size components of automobile parts, that are for appearance, and for interior.
  Molding Dies with Mechanism
We product the molding dies using the latest equipment and our experienced technology.
   
         
 Manufacturing Instruments / Measuring Instruments
Varnish Impregnation Machines
We produce the varnish impregnation machine for alternator and starter.
       
         
Inquiries about this page

 NEW Product info
Unsaturated Polyester Molded Parts (Premix Molded Parts)
Phenolic Molded Parts
Epoxy Molded Parts

 Related info
Molding Compounds for Semiconductor Encapsulation
Molding Compounds
Functional Materials
Printed Circuit Board Materials
Chemical Engineering Materials
Molded Products
Molding Dies
Manufacturing Instruments / Measuring Instruments
   
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