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KYOCERA Corporation (Global Web Site)
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Circuit and Electronic Components
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Circuit and Electronic Components
Functional Materials
High Thermal Conductive Pastes
Good for chip capacitor joints and circuit formation using good conductivity.
Pastes for Flip Chip Assembly use
Flip chip mount of COB. COG can be done.
Eutectic Joint Applicable NCP
Eutectic joint of COB. COG can be done.
Printed Circuit Board Materials
Heat-Resistant Halogen-Free FPC Materials: Flexible Copper Clad Laminates
Opposing two-layered flexible copper clad laminates with high heat-resistance.
Heat-Resistant Halogen-Free FPC Materials: Coverlays (Cover Films)
Possesses high reliability of insulation equivalent to rigid circuit boards.
Heat-Resistant Halogen-Free FPC Materials: Bonding Sheets
Possesses high heat-resistance. Good for multilayered FPCs and COFs.
FPC Materials: Flexible Copper Clad Laminates
Flexible copper clad laminates based on polyimide film.
FPC Materials: Coverlays (Cover Films)
Coverlay films based on poly-imide film.
FPC Materials: Bonding Sheets
Bonding sheet for multilayered FPCs, stiffener sheets, etc.
Chemically Engineered Materials
Electrical / Electronic Part Application Resins
Liquid type insertion resins for electrical devices. Possesses good results for long term use..
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