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Circuit and Electronic Components
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Circuit and Electronic Components
Functional Materials
High Thermal Conductive Pastes
It is good for chip capacitor joint and circuit formation using good conductivity.
Pastes for Flip Chip Assembly use
Flip chip mount of COB. COG can be done.
Eutectic Joint Applicable NCP
Eutectic Joinｔ of COB / COG. can be done.
Printed Circuit Board Materials
Super Flexible Copper Clad
It is flexible copper clad laminate based on glass cloth.
Super Bonding Sheet
It is powder free type bonding sheet with good handling.
Heat-Resistance Halogen-free FPC Materials : Flexible Copper Clad Laminate
It is opposing 2 layered flexible copper clad laminate with high heat-resistance.
Heat-Resistance Halogen-free FPC Materials : Coverlay (Cover Film)
It has high reliability of insulation same as rigid circuit board.
Heat-Resistance Halogen-free FPC Materials : Bonding Sheet
It has high heat-resistance. It is good for multi layered FPC and COF.
FPC Materials : Flexible Copper Clad Laminate
It is Flexible Copper Clad Laminate based on Poly-Imide film.
FPC Materials : Coverlay (Cover Film)
It is Coverlay film based on Poly-Imide film.
FPC Materials : Bonding Sheet
It is bonding sheet for multi layered FPC, stiffener sheet, and so on.
Thermosetting PPE Printed Circuits Board Materials : For High Frequency
It's transmission loss is very low because low ε and low tanδ.
Thermosetting PPE Printed Circuits Board Materials : For High Frequency of Multilayer
It is very easy to molding and processing. It is lowε and lowtanδ.
Chemical Engineering Materials
Electrical / Electronic Parts Application Resins
It is liquid type insertion resin for electrical device. And it has good results for long time.
Related info
Functional Materials
Printed Circuit Board Materials
Chemical Engineering Materials
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