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| Semiconductors |
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High reliability is required for semiconductor materials.
We propose "TOTAL PACKAGE SOLUTION" for the improvement of semiconductor reliability, for example Molding compound for semiconductor encapsulation, conductive pastes, and so on.
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| Circuit and Electronic Components |
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Down sizing about circuit and components brings small size electronic equipments. According to those requires, we offer high reliability circuit board materials and component materials.
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| Automobile Parts |
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High reliability is required for car components. We have long time experience about it. Our development of molding compound for semiconductor encapsulation and casting rein are based on those experience.
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| Office Automation Equipments |
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We provide light weight premix molded parts, magnesium-molded parts, and high level flame retardant phenolic molding materials for lightening of office automation apparatus.
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| Power and Energy Fields |
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Light weight premix molded parts and , magnesium-molded parts contribute to lightening of equipments. Our insulating varnish has long time experiment. It is used for dynamo and heavy electric equipment.
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| Healthy Life Relation / Physics and Chemistry |
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We have good results about GFRP and CFRP producted by pultrusion molding that are applied to fishing tackle, poles for agriculture, manufacturing device for LCD. Charge measurement instrument for powder are produced over 300 pcs.
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Japanese
