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Semiconductors
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Semiconductors
Molding Compounds for Semiconductor Encapsulation
Molding Compounds for Laminate Packages
Used for memory card.
Molding Compounds for Surface Mount Devices : Environmental Friendly type
It can achieve level 1 of JEDEC because of it's high reliability.
Molding Compounds for Surface Mount Devices : Standard(Br/Sb) type
It is easy to mold. And It can use high temperature reflow process.
Molding Compounds for Small Signal Packages
It is easy to mold. We provide extra small type and pin insertion type.
Molding Compounds for General Packages : Standard Low Stress type
It is easy to mold. It is good for large size LSI.
Molding Compounds for General Packages : High Tg and Low Stress type
It is good for module.
Molding Compounds for General Packages : Environment Friendly type
We prepare flame resistant-free materials.
Molding Compounds for Power Devices
It is good for requirement of heat radiation.
Functional Materials
Electric Conductive Pastes for General use
It is die attach paste. It can use for compound Semiconductor ( ex. LED).
High Thermal Conductive Pastes
It can be used to substitute internal soldering for die attach. It is good for joint of high luminance LED.
Electric Conductive Pastes for Pb-Free
It is die attach paste high temperature reflow process. It can use high temperature reflow process.
Pastes for Flip Chip Assembly use
It is paste for flip chip mounting using pressure welding process.
Eutectic Joint Applicable NCP
It can mount the flip chip using eutectic joint.
Photo-Sensitive Passivation Materials for Wafer-Coating
It has high resolution. We have positive type and negative type.
Heat-Resistance Poly-Imide Resin for Wafer-Coating
We add the function of low temperature Thermosetting to heat-resistance poly-imide resin.
Molded Products
CFRP
It is pultrusion molded parts that are light weight, high strength, high degree of elasticity, good strength to climate, and good chemical resistance.
Related info
Molding Compounds for Semiconductor Encapsulation
Functional Materials
Molded Products
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