Circuit and Electronic Components
Office Automation Equipment
Lifestyle / Physics / Chemistry
KYOCERA Corporation (Global Web Site)
Molding Compounds for Semiconductor Encapsulation
Molding Compounds for Laminate Packages
Used for memory cards.
Molding Compounds for Surface Mount Devices: Environmentally Friendly Type
Passed level 1 of JEDEC due to its high reliability.
Molding Compounds for Surface Mount Devices: Standard (Br/Sb) Type
Easy to mold. Can use high temperature reflow process.
Molding Compounds for Small Signal Packages
Easy to mold. We provide extra small and pin insertion types.
Molding Compounds for General Packages: Standard Low Stress Type
Easy to mold. Good for large size LSI.
Molding Compounds for General Packages: High Tg and Low Stress Type
Good for modules.
Molding Compounds for General Packages: Environmentally Friendly Type
We prepare flame resistant-free materials.
Molding Compounds for Power Devices
Good for heat radiation requirements..
Electric Conductive Pastes for General use
Die attach paste for use in compound semiconductors (ex. LEDs).
High Thermal Conductive Pastes
Can be used to substitute internal soldering for die attach. Good for joints of high luminance LEDs.
Electric Conductive Pastes for Pb-Free
Die attach paste for high temperature reflow process.
Pastes for Flip Chip Assembly use
Paste for flip chip mounting using pressure welding process.
Eutectic Joint Applicable NCP
Can mount the flip chip using eutectic joint.
Photo-Sensitive Passivation Materials for Wafer-Coating
Possess high resolution. We have positive and negative types.
Heat-Resistant Polyimide Resins for Wafer-Coating
We add low temperature thermosetting to heat-resistant poly-imide resins.
Pultrusion molded parts that are lightweight, high strength, and possess high degree of elasticity, good strength to climate, and good chemical resistance.
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