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	High Density Assembly


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Products > Design Purpose > High Density Assembly	Japanese
High Density Assembly

High Density Assembly

Molding Compounds for Semiconductor Encapsulation


Molding Compounds for Laminate Packages Materials for narrow pitch and chip stack packages.

Functional Materials


Electric Conductive Pastes for General use Used for die-bonding materials of CSP such as BGA.		High Thermal Conductivity Pastes Possesses good heat dissipation to prevent package temperature rise.		Electric Conductive Pastes for Pb-Free Used for die-bonding materials of CSP such as BGA.

Pastes for Flip Chip Assembly use Pastes for fine pitch flip chip assembly.		Eutectic Joint Applicable NCP We suggest some pastes for eutectic bonding. Possesses high solder joint reliability.

Printed Circuit Board Materials


Heat-Resistant Halogen-Free FPC Materials: Flexible Copper Clad Laminates Highly heat-resistant flexible copper clad laminates.		Heat-Resistant Halogen-Free FPC Materials: Coverlays (Cover Films) High insulation reliability equivalent to rigid circuit boards.		Heat-Resistant Halogen-Free FPC Materials: Bonding Sheets With high heat-resistance, best suited for multilayered flexible printed board and COF (Chip on Film).

FPC Materials: Flexible Copper Clad Laminates Excellent flexion, polyimide flexible copper clad laminate.		FPC Materials: Coverlays (Cover Films) Cover films based on polyimide film.		FPC Materials: Bonding Sheets Adhesive sheets which can be used as multilayered flexible printed boards, gluing stiffener sheets together: low dielectric constants and low electric dissipation.

Products > Design Purpose > High Density Assembly

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