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High Density Assembly
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High Density Assembly
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High Density Assembly
Molding Compounds for Semiconductor Encapsulation
Molding Compounds for Laminate Packages
Materials for narrow pitch and chip stack packages.
Functional Materials
Electric Conductive Pastes for General use
Used for die-bonding materials of CSP such as BGA.
High Thermal Conductivity Pastes
Possesses good heat dissipation to prevent package temperature rise.
Electric Conductive Pastes for Pb-Free
Used for die-bonding materials of CSP such as BGA.
Pastes for Flip Chip Assembly use
Pastes for fine pitch flip chip assembly.
Eutectic Joint Applicable NCP
We suggest some pastes for eutectic bonding. Possesses high solder joint reliability.
Printed Circuit Board Materials
Heat-Resistant Halogen-Free FPC Materials: Flexible Copper Clad Laminates
Highly heat-resistant flexible copper clad laminates.
Heat-Resistant Halogen-Free FPC Materials: Coverlays (Cover Films)
High insulation reliability equivalent to rigid circuit boards.
Heat-Resistant Halogen-Free FPC Materials: Bonding Sheets
With high heat-resistance, best suited for multilayered flexible printed board and COF (Chip on Film).
FPC Materials: Flexible Copper Clad Laminates
Excellent flexion, polyimide flexible copper clad laminate.
FPC Materials: Coverlays (Cover Films)
Cover films based on polyimide film.
FPC Materials: Bonding Sheets
Adhesive sheets which can be used as multilayered flexible printed boards, gluing stiffener sheets together:
low dielectric constants and low electric dissipation.
Thermosetting PPE Printed Circuits Board Materials: High Frequency
We achieve extremely low transmission loss materials by low-k (low dielectric constant) and low-loss materials.
Thermosetting PPE Printed Circuits Board Materials: Multilayer High Frequency
These materials possess superior technological properties, low-k (low dielectric constant) and low-loss materials.
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Related Information
Molding Compounds for Semiconductor Encapsulation
Functional Materials
Printed Circuit Board Materials
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