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High Density Assembly
KYOCERA Corporation
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High Density Assembly
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High Density Assembly
Molding Compounds for Semiconductor Encapsulation
Molding Compounds for Laminate Packages
The materials are made for Narrow Pitch and Chip Stack Packages.
Functional Materials
Electric Conductive Pastes for General use
Use for die-bonding materials of CSP such as BGA.
High Thermal Conductive Pastes
It has good heat dissipation, so it prevents the package temperature to rise.
Electric Conductive Pastes for Pb-Free
For die-bonding materials of CSP such as BGA.
Pastes for Flip Chip Assembly use
Paste for fine pitch flip chip assembly.
Eutectic Joint Applicable NCP
We suggest some pastes for Eutectic Bonding, have high solder joint reliability.
Printed Circuit Board Materials
Super Bonding Sheet
Powder free type, adhesive sheet.
Heat-Resistance Halogen-free FPC Materials : Flexible Copper Clad Laminate
High heat-resistant Flexible Copper Clad Laminate.
Heat-Resistance Halogen-free FPC Materials : Coverlay (Cover Film)
High insulation reliability equal to rigid circuit board.
Heat-Resistance Halogen-free FPC Materials : Bonding Sheet
With high heat-resistance, best suit for Multi-layered Flexible Printed Board and COF (Chip on Film).
FPC Materials : Flexible Copper Clad Laminate
Excellent flexion, polyimide flexible Copper Clad Laminate.
FPC Materials : Coverlay (Cover Film)
Cover film based on polyimide film.
FPC Materials : Bonding Sheet
Adhesive sheet which can be used as Multi-layered Flexible Printed Board, gluing Stiffener Sheets together
Low Dielectric Constants
Low electric dissipation.
Thermosetting PPE Printed Circuits Board Materials : For High Frequency
We achieve extremely low transmission loss materials by low-k (low dielectric constant) and low-loss materials.
Thermosetting PPE Printed Circuits Board Materials : For High Frequency of Multilayer
These materials are superior to technological property and low-k (low dielectric constant) and low-loss materials.
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Related info
Molding Compounds for Semiconductor Encapsulation
Functional Materials
Printed Circuit Board Materials
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