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| Environmentally Friendly Products |
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We were early to commercialize environmentally friendly materials including Molding Compounds for Semiconductor Encapsulation and Printed Circuit Board Materials. These are Pb-free mountings which are RoHS/WEEE regulated. We also offer Casting Resins which are halogen-free.
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| Weight Reduction |
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Weight reduction contributes to energy-saving, which is one of the important ways to cut CO2 emissions, as well as an important technology for a ubiquitous society. We constantly strive for weight reduction both in components and in materials.
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| Heat Resistance |
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More demands rise for heat-resistant components and materials, especially for the automotive industry. To meet these needs, we have a product lineup for a variety of heat-resistant materials, including Molding Compounds for Semiconductor Encapsulation and Phenol Molding Compounds.
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| High Density Assembly |
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High Density Assembly is an essential technology for miniaturization and weight reduction of electronics. We provide a wide variety of materials such as flexible printed boards which are highly moisture-resistant.
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Japanese
