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| Environment-Preserving Products |
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We are early to carry out productization of environment-preserving materials,
productize of Molding Compounds for Semiconductor Encapsulation / Printed Circuit Board Materials. They are for Pb-free mounting which RoHS/WEEE regulate. We also offer a product lineup for, Molding Compounds for Semiconductor Encapsulation, Printed Circuit Board Materials, Casting Resin, which are halogen-free.
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| Weight Reduction |
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Weight Reduction, it can make energy-saving, is one of the useful means to cut down CO2, and also important technology to realize ubiquitous society. We are approaching reduction both in components, and in materials.
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| Heat-Resistance |
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More demands rise for Heat-Resistance of components and materials, especially those in cars. To meet the needs, we have a product lineup for a variety of Heat-Resistant materials, such as Molding Compounds for Semiconductor Encapsulation, Phenol Molding Compounds.
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| High Density Assembly |
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High Density Assembly is essential technology for downsizing and weight reduction of electronics. We provide wide variety of materials such as flexible printed boards which is high moisture-resistant.
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Japanese
