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Products > Design Purpose > Weight Reduction  Japanese

Weight Reduction

 
Weight Reduction

 Molding Compounds for Semiconductor Encapsulation
Molding Compounds for Laminate Packages
High fluidity and less warpage materials applicable to ultra-thin BGA.
  Molding Compounds for Surface Mount Devices : Environmental Friendly type
For Pb-free of thin package.
  Molding Compounds for Small Signal Packages : For Surface Mount Device
Encapsulating materials for ultra small package used in mobile phones.

 Molding Compounds
Injection Molding Epoxy Compounds for Highly Precision Materials
Used in precise materials which needs dimensional precision / stability.
  Premix for Light Weight
Superior in mechanical strength ,low in specific gravity(1.0~1.6).
   

 Molded Products
Magnesium-Molded Parts
We have worked on thin-type; reduction in weight; recycling efficiency from early on and are leading top-class in this field.
  Unsaturated Polyester Molded Parts (Premix Molded Parts)
NEW!
Used in wide range of fields, small electronic parts to large?size components.
  Phenolic Molded Parts
NEW!
Widely used in auto molding parts or electronic parts which need high heat-resistance.
         
Epoxy Molded Parts
NEW!
Utilized in office equipments as replacements of metal parts by them, in purpose of reducing weight.
  CFRP
It has high specific strength, also light, high strength and elasticity modulus.Pultrusion Molded Parts of high dimensional accuracy.
   
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 NEW Product info
Unsaturated Polyester Molded Parts (Premix Molded Parts)
Phenolic Molded Parts
Epoxy Molded Parts

 Related info
Molding Compounds for Semiconductor Encapsulation
Molding Compounds
Molded Products
   
 
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