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Weight Reduction
Molding Compounds for Semiconductor Encapsulation
Molding Compounds for Laminate Packages
Materials with high fluidity and less warpage, applicable to ultra-thin BGAs.
Molding Compounds for Surface Mount Devices: Environmentally Friendly Type
Pb-free for thin packages.
Molding Compounds for Small Signal Packages: For Surface Mount Devices
Encapsulating materials for ultra small packages used in mobile phones.
Molding Compounds
Injection Molding Epoxy Compounds for High-Precision Materials
Used in precise materials which require dimensional precision and stability.
Premix for Light Weight
Superior mechanical strength, low specific gravity (1.0-1.6).
Molded Products
Magnesium-Molded Parts
We are a leader in the field for thin-type, weight reduction and recycling efficiency.
Unsaturated Polyester Molded Parts (Premix Molded Parts)
Small electronic parts to large-size components used in a wide range of fields.
Phenolic Molded Parts
Widely used in auto molding parts and electronic parts which require high heat-resistance.
Epoxy Molded Parts
Used in office equipment as replacements for metal parts to reduce weight.
CFRP
Possesses high specific strength, light weight, high strength and elasticity modulus. Pultrusion molded parts with high dimensional accuracy.
NEW Product Information
Unsaturated Polyester Molded Parts (Premix Molded Parts)
Phenolic Molded Parts
Epoxy Molded Parts
Related Information
Molding Compounds for Semiconductor Encapsulation
Molding Compounds
Molded Products
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