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Products > Design Purpose > Heat Resistance	Japanese
Heat Resistance

Molding Compounds for Semiconductor Encapsulation


Molding Compounds for Surface Mount Devices: Environmentally Friendly Type We provide high temperature storage performance for lead-frame surface mount devices.	Molding Compounds for General Packages: Environmentally Friendly Type We provide high temperature storage performance for pin insertion packages.	Molding Compounds for Power Devices Good for applications with heat radiation requirements.

Molding Compounds


Non-Flammable Molding Compounds Reliable compounds for flame retardance, which are widely applicable to heat resistant parts.	Ammonia-Free Molding Compounds Do not generate ammonia gas, thus are recommended for closed equipment systems.	Super Heat-Resistant Molding Compounds Reliable compounds which enable consecutive use in temperatures over 200 degrees Celsius.

Functional Materials


Photo-Sensitive Passivation Materials for Wafer-Coating Highly heat-resistant, photo-sensitive passivation materials based on polyimide resins.		Heat-Resistant Polyimide Resins for Wafer-Coating This product starts with a highly heat-resistant polyimide resin, with added functionality.

Printed Circuit Board Materials


Heat-Resistant Halogen-Free FPC Materials: Flexible Copper Clad Laminates Opposing 2-layered flexible copper clad laminates with high heat resistance.	Heat-Resistant Halogen-Free FPC Materials: Coverlays (Cover Films) Possess high reliability of insulation equal to rigid circuit boards.	Heat-Resistant Halogen-Free FPC Materials: Bonding Sheets Possess high heat resistance, good for multilayered FPCs and COFs.

Chemically Engineered Materials


Non-Solvent Type Varnishes UL certified products which have characteristics of rapid curing, high adhesiveness, high heat resistance, and a track record of being used in diverse fields.	Solvent Type Varnishes UL certified products offer superior insulation and high heat resistance.	Magnet Wire Coating Varnishes Possess Class H heat resistance, high workability, and easy chemical separation.

Casting Resins for Ignition Coils Possess good insulation even in high temperature circumstances around the engines.	Insulating Resins for Heavy Electric Equipment Good insulation in energization at high temperature, offers superior reliability for the long term.	Resins for Electrical / Electronic Part Applications Can be used as encapsulating thermogenic devices with high reliability.

Molded Products


TC Boards: Highly Heat-Resistant Type We provide an insulating board which offers superior flame retardance for use in a variety of electrical equipment and structural materials.

Related Information


	Molding Compounds for Semiconductor Encapsulation
	Molding Compounds
	Functional Materials
	Chemically Engineered Materials
	Molded Products

Products > Design Purpose > Heat Resistance

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