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Molding Compounds for Semiconductor Encapsulation
 
Molding Compounds
 
Functional Materials
 
Printed Circuit Board Materials
 
Chemical Engineering Materials
 
Molded Products
 
Molding Dies
 
Manufacturing Instruments / Measuring Instruments
 
 Applications more
Applications
Semiconductors
 
Circuit and Electronic Components
 
Automobile Parts
 
Office Automation Equipments
 
Power and Energy Fields
 
Healthy Life Relation / Physics and Chemistry
 
 Design Purpose more
Design Purpose
Environment-Preserving Products
 
Weight Reduction
 
Heat-Resistance
 
High Density Assembly
 

Product List

 NEW! is new products or product infomation renewal
Molding Compounds for Semiconductor Encapsulation
· Molding Compounds for Laminate PackagesNEW!
· Molding Compounds for Surface Mount Devices
· Molding Compounds for Small Signal Packages
· Molding Compounds for General Packages
· Molding Compounds for Power Devices
Molding Compounds
· Phenolic Molding Compounds (TECOLITE) NEW!
· Epoxy Molding CompoundsNEW!
· Unsaturated Polyester Molding Compounds (Premix)NEW!
· Thermosetting Polyimide Resin (IMIDALLOY)NEW!
Functional Materials
· Electric Conductive Pastes
· Anisotropic Conductive Pastes
· Heat-Resistance Passivation Materials
   
Printed Circuit Board Materials
· Super Series FPC Materials
· Heat-Resistance Halogen-free FPC Materials
· FPC Materials
· Thermosetting PPE Printed Circuits Board Materials
Chemical Engineering Materials
· Insulating VarnishesNEW!
· Casting ResinNEW!
Molded Products
· Magnesium-Molded Parts
· Plastic Molded Parts
· Thermosetting Molded Parts NEW!
· CFRP/GFRP Pultrusion Molded PartsNEW!
· TC BoardsNEW!
Molding Dies
· Product Information
 
 
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Product Detail

  KYOERA Chemical's Product Classification and Product Name detail is here more(Product System)
 
 

Change history
   ·Casting Resin
   ·Unsaturated Polyester Molding Compounds (Premix)
   ·Phenolic Molding Compounds (TECOLITE)
   ·Thermosetting Polyimide Resin (IMIDALLOY)
   ·Casting Resin
   ·Chemical Engineering Materials
   ·CFRP/GFRP Pultrusion Molded Parts
   ·TC Boards
   ·Epoxy Molding Cpmpounds
   ·Molding Cpmpounds
   ·Thermosetting Molded Parts
   ·Molding Cpmpounds for Laminate Packages
   ·Molding Compounds for Semiconductor Encapsulation
   ·Insulating Varnishes
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