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Molding Compounds for Semiconductor Encapsulation
Molding Compounds
Functional Materials
Printed Circuit Board Materials
Chemically Engineered Materials
Molded Products
Applications
Semiconductors
Circuit and Electronic Components
Automotive Components
Office Automation Equipment
Energy Sector
Lifestyle / Physics / Chemistry
Design Purpose
Environmentally Friendly Products
Weight Reduction
Heat Resistance
High Density Assembly
Product Lineup
Molding Compounds for Semiconductor Encapsulation
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Molding Compounds for Laminate Packages
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Molding Compounds for Surface Mount Devices
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Molding Compounds for Small Signal Packages
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Molding Compounds for General Packages
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Molding Compounds for Power Devices
Molding Compounds
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Phenolic Molding Compounds (TECOLITE)
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Epoxy Molding Compounds
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Unsaturated Polyester Molding Compounds (Premix)
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Thermosetting Polyimide Resins (IMIDALLOY)
Functional Materials
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Electric Conductive Pastes
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Anisotropic Conductive Pastes
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Heat-Resistant Passivation Materials
Printed Circuit Board Materials
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Heat-Resistant Halogen-Free FPC Materials
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FPC Materials
Chemically Engineered Materials
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Insulating Varnishes
(Impregnation Resin)
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Casting Resins
Molded Products
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Magnesium-Molded Parts
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Plastic Molded Parts
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Thermosetting Molded Parts
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CFRP / GFRP Pultrusion Molded Parts
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TC Boards
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