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Products > Product System  Semiconductor Encapsulation | Molding Compounds | Functional Materials | Printed Circuit Board | Chemical Engineering Materials | Molded Products | Molding Dies | Instruments

Product System

Product Classification Product Name
Major Division Medium Minor
Molding Compounds for Semiconductor Encapsulation Molding Compounds for Laminate Packages Environmental Friendly type KE-G1200 Series
KE-G1250 Series
KE-G1270 Series
Standard(Br/Sb) type KE-1100A
(KE-2100A) Series
KE-1150
(KE-2150) Series
Molding Compounds for Surface Mount Devices Environmental Friendly type KE-G3000 Series
KE-G3400 Series
KE-G280 Series
Standard(Br/Sb) type KE-200D Series
KE-320D Series
Molding Compounds for Small Signal Packages For Surface Mount Device KE-520 Series
KE-300F Series
For Insertion Devices KE-300K Series
Molding Compounds for General Packages Standard Low Stress type KE-300 Series
KE-320 Series
High Tg and Low Stress type KE-1000SV Series
Environment Friendly type KE-G200 Series
KE-G240 Series
Molding Compounds for Power Devices High Thermal Conductivity type KE-850 Series
KE-870 Series
KE-880 Series
Major Division Medium Minor Product Name
Molding Compounds Phenolic Molding Compounds "TECOLITE" High Insulation Molding Compounds KM-13B(G)
KM-13N(G)
General Insulation Molding Compounds KM-30B(J)
KM-36C-
KM-50BD
Rapid Cure General Purpose Molding Compounds KM-727JK
KM-747(J)
KM-757(J)
Non Flammable Molding Compounds KM-450(J)
KM-460(J)
KM-470(G)
Impact Resistance Molding Compounds KM-245(G)
KM-3000(J)
Ammonia-Free Molding Compounds KM-220(J)
KM-350(G)
High Strength Molding Compounds KM-6540(J)
KM-7000(G)
Super Heat-Resistance Molding Compounds KM-1000
KM-2000(G)
Epoxy Molding Compounds Injection Molding Epoxy Compounds for Highly Precision Materials KE-4200
Unsaturated Polyester Molding Compounds "Premix" For Encapsulation Molding AP-200 Series
AP-400 Series
AP-900 Series
For High Precision Molding Parts AP-700 Series
XP-9003 Series
For Electric Parts AP-600 Series
AP-900 Series
For Special Purpose AP-700 Series
For Lightweight AP-700 Series
Thermosetting Polyimide Resin (IMIDALLOY)   KIR-30
Major Division Medium Minor Product Name
Functional Materials Electric Conductive Pastes Electric Conductive Pastes for General use CT200 Series
High Thermal Conductive Pastes CT284 Series
Electric Conductive Pastes for Pb-Free CT265 Series
Anisotropic Conductive Pastes Pastes for Flip Chip Assembly use TAP/TNP Series
Eutectic Joint Applicable NCP XAP0289 Series
Heat-Resistance Passivation Materials Photo-Sensitive Passivation Materials for Wafer-Coating CT4000 Series
Heat-Resistance Poly-Imide Resin for Wafer-Coating CT4000 Series
Major Division Medium Minor Product Name
Printed Circuit Board Materials Super Series FPC Materials Super Bonding Sheet TFA-990 Series
Heat-Resistance Halogen-free FPC Materials Flexible Copper Clad Laminate TLF-530 Series
Coverlay (Cover Film) TFA-560 Series
Bonding Sheet TFA-890 Series
FPC Materials Flexible Copper Clad Laminate TLF-521 Series
Coverlay (Cover Film) TFA-577 Series
Bonding Sheet TFA-880 Series
Thermosetting PPE Printed Circuits Board Materials For High Frequency TLC-598 Series
For High Frequency of Multilayer TLC-596 Series
Major Division Medium Minor Product Name
Chemical Engineering Materials Insulating Varnishes Non-Solvent Type Varnishes Non-Solvent Type TVB Series
Solvent Type Varnishes Solvent Type TVA,TVB Series
Magnet Wire Coating Varnishes Magnet Wire Coating TVE Series
Casting Resin Nonflammable Resins for High Voltage Transformer TCG1100 Series
Casting Resin for Ignition Coil TCG1600 Series
Insulating Resin for Heavy Electric Equipment TCG1900 Series
Electrical / Electronic Parts Application Resins TCG1800 Series
TCG5000 Series
Major Division Medium Minor Product Name
Molded Products Magnesium-Molded Parts    
Plastic Molded Parts    
Thermosetting Molded Parts Unsaturated Polyester Molded Parts (Premix Molded Parts)  
Phenolic Molded Parts  
Epoxy Molded Parts  
CFRP/GFRP Pultrusion Molded Parts GFRP
(Glass Fiber Reinforced Plastic)
C Series
HA Series
CFRP
(Carbon Fiber Reinforced Plastic)
CF Series
CH Series
E Series
TC Boards for Flame Resistant TC-F1
for High Flame Resistant TC-F2
for High Mechanical Strength and Flame Resistant TC-F3
for Acid Resistant, Flame Resistant TC-F4
for Suflic Acid Resistant, Flame Resistant TC-F5
Major Division Medium Minor Product Name
Molding Dies Product Information Molding Dies for Components of Automobiles  
Molding Dies for Components of Household Appliances  
Molding Dies with Mechanism  
Major Division Medium Minor Product Name
Manufacturing Instruments / Measuring Instruments Varnish Impregnation Machines    
Electrification Measurement Instruments    
 
 
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