| Pastes for Flip Chip Assembly use (ACP/NCP) |
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KYOCERA Chemical's ACP are ideal for flip chip mounting of high performance packages such as COB, COG, and TAB.
Other applications for our ACP are mobile telecommunications, PDA, CCD camera, PC card, and MCM.
·TAP/TNP Series  (pdf/85KB) |
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| Eutectic Joint Applicable NCP |
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KYOCERA Chemical developed the industry's first heat eutectic, pre-applied underfill for flip chip connections.
Our NCP allows for the alloying and the resin sealed processes of the electrode to be done at the same time, thus increasing productivity and enhancing the reliability of connections after heat cycles.
·XAP0289 Series (pdf/39KB) |
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Japanese
