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| Molding Compounds for Semiconductor Encapsulation |
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Our Products:
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Molding Compounds for Laminate Packages |
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Molding Compounds for Surface Mount Devices |
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Molding Compounds for Small Signal Packages |
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Molding Compounds for General Packages |
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Molding Compounds for Power Devices |
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| Molding Compounds |
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Our Products:
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Phenol Molding Compounds "TECOLITE" |
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Epoxy Molding Compounds |
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Unsaturated Polyester Molding Compounds "Premix" |
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Thermosetting Polyimide Resin "IMIDALLOY" |
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| Functional Materials |
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Our Products:
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Electric Conductive Pastes |
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Anisotropic Conductive Pastes |
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Heat-Resistance Passivation Materials |
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| Printed Circuit Board Materials |
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Our Products:
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Super Series FPC Materials |
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Heat-Resistance Halogen-free FPC Materials |
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FPC Materials |
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Thermosetting PPE Printed Circuits Board Materials |
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(FPC···Flexible Printed Circuits)
(PPE···Poly Phenylene Ether) |
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| Chemical Engineering Materials |
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Our Products:
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Insulating Varnishes |
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Casting Resin |
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| Molded Products |
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Our Products:
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Magnesium-Molded Parts |
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Plastic Molded Parts |
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Thermosetting Molded Parts |
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CFRP/GFRP Pultrusion Molded Parts |
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TC Boards (Insulating Plate) |
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| Molding Dies |
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Our Products:
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Molding Dies for Components of Automobiles |
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Molding Dies for Components of Household Appliances |
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Molding Dies with Mechanism |
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