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| KYOCERA Chemical's Molding Compounds provide a superior resin properties and excellent moldability for electrical equipments and electronic device use. Newly developed Epoxy and Phenolic Molding compound is designed highly reliability for semiconductor package and various parts to using a heavy duty electric equipment. KYOCERA Chemical facility is recognized as a ISO 9001 supplier and ISO 14001 supplier. |
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| Phenolic Molding Compounds "TECOLITE" |
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 "TECOLITE" have good electric property, good heat resistance, highly mechanical strength, good dimension stability and superior chemical resistance. "TECOLITE" also have wide range moldability, high productivity and good reliability for parts.
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Phenolic Molding Compounds |
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| Epoxy Molding Compounds (For Injection mold) |
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 Epoxy molding compounds have a superior molding accuracy and good dimension stability to compare with conventional plastic materials and thermosetting molding compounds. This molding compound is recommended for various precise electronic parts.
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Epoxy Molding Compounds |
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| Unsaturated Polyester Molding Compounds "Premix" |
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 "Premix" is characterized by zero mold shrinkage or very low molding shrinkage. "Premix" provide excellent moldability and good reliability for various type of electric and electronic parts, for example, small size electronic parts and a very big size insulation equipment.
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Unsaturated Polyester Molding Compounds |
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| Thermosetting Polyimide Resin "IMIDALLOY" |
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 "IMIDALLOY" is recommended for diamond grind wheel, friction material, some kind of grind stone.
And, "IMIDALLOY" can be used as a resin for the molding compound.
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IMIDALLOY KIR-30  (pdf/70KB)
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Japanese
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