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| Kyocera chemical's Molding Compounds provide superior resin properties and excellent moldability for electrical equipment and electronic devices. Our newly developed epoxy and phenolic molding compounds are designed for high reliability in semiconductor packages and various parts for use in heavy-duty electric equipment. Kyocera chemical’s manufacturing facilities are ISO 9001 and ISO 14001 certified. |
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| Phenolic Molding Compounds "TECOLITE" |
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 "TECOLITE" has good electric property, good heat resistance, high mechanical strength, good dimensional stability and superior chemical resistance. "TECOLITE" also has wide-ranging moldability, high productivity and good reliability for parts.
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Phenolic Molding Compounds |
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| Epoxy Molding Compounds
(For Injection Molds) |
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 Epoxy molding compounds have superior molding accuracy and good dimensional stability compared with conventional plastic materials and thermosetting molding compounds. These molding compounds are recommended for various precision electronic parts.
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Epoxy Molding Compounds |
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| Unsaturated Polyester Molding Compounds "Premix" |
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 "Premix" is characterized by zero to very low molding shrinkage. "Premix" provides excellent moldability and good reliability for various types of electric and electronic parts; for example, small size electronic parts and extremely large size insulation equipment.
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Unsaturated Polyester Molding Compounds |
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| Thermosetting Polyimide Resins "IMIDALLOY" |
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 "IMIDALLOY" is recommended for diamond grind wheels, friction materials, and some kinds of grind stones.
Also, "IMIDALLOY" can be used as a resin for molding compounds.
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IMIDALLOY KIR-30 (pdf/70KB) |
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