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Molding Compounds for Semiconductor Encapsulation
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Products > Lineup > Molding Compounds for Semiconductor Encapsulation > Molding Compounds for General Packages    Japanese  

Molding Compounds for General Packages

 
 Standard Low Stress Type
We provide a series of standard low stress compounds with high reliability to cover various applications such as LSI, transistors and diodes.

·KE-300 Series
·KE-320 Series(pdf/52KB)PDF
 
 High Tg and Low Stress Type
Compared to conventional multipurpose compounds, this series of compounds provides higher glass transition temperature and lower molding shrinkage ratios. After molding, stress fluctuation due to compound low elasticity is also kept to a minimum level.

·KE-1000SV Series(pdf/52KB)PDF
 
 Environmentally Friendly Type
We provide environmentally friendly low stress molding compound based on multipurpose epoxy molding compound base resins. The same conditions as conventional types are applicable.

·KE-G200 Series
·KE-G240 Series(pdf/52KB)PDF

   
 
Products > Lineup > Molding Compounds for Semiconductor Encapsulation > Molding Compounds for General Packages 
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