| Standard Low Stress type |
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Provide series of Standard Low Stress Compound with high reliability to cover various types of application such as LSI, Transistors and diodes.
·KE-300 Series
·KE-320 Series (pdf/52KB) |
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| High Tg and Low Stress type |
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Comparing to conventional multipurpose compound, this series of compound provides higher glass transition temperature and small molding shrinkage ratio. After molding Stress Fluctuation due to compound low elasticity is also controlled at minimum level.
·KE-1000SV Series(pdf/52KB) |
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| Environment Friendly type |
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Provide environment friendly low stress molding compound base on multipurpose epoxy molding compound base resin. Same conditions as conventional type are applicable.
·KE-G200 Series
·KE-G240 Series(pdf/52KB) |
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Japanese
