| KYOCERA Chemical's molding compounds have undergone long testing R&D effort to develop the most advanced technology materials. It is currently being used in many areas of semiconductor applications. Our product group is suitable for use for environment requirements for halogen free technology. For our customers, it is target for use for Pb-free packages and for high temperature storage environment. High level reliability is expected from KYOCERA Chemical's molding compounds. |
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| Molding Compounds for Laminate Packages |
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 With good filling characteristics, high Tg resin for package that produce minimum warpage and high reliability.
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· Environmental Friendly type
· Standard(Br/Sb) type |
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| Molding Compounds for Surface Mount Devices |
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 For satisfaction of Pb free solder that requires high reflow temperatures, especially suitable for Alloy 42, copper, Pd/Au plated frame.
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· Environmental Friendly type
· Standard(Br/Sb) type |
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| Molding Compounds for Small Signal Packages |
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 EMC with good productivity for TO-92 devices. We have a wide array of line-up that is suitable for very small package type. It is able to answer the needs of our customers.
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· For Surface Mount Device
· For Insertion Devices |
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| Molding Compounds for General Packages |
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 For the encapsulation purpose of semiconductor packages and also for coil applications used in electronics devices, our low stress resin can provide superior reliability.
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· Standard Low Stress type
· High Tg and Low Stress type
· Environment Friendly type |
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| Molding Compounds for Power Devices |
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 For power transistors that need high heat dissipation, we can provide EMC that is good for this character and also ability to have good moisture resistivity.
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· High Thermal Conductivity type |
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| Design Purpose |
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Japanese
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