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Molding Compounds for Semiconductor Encapsulation |
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| Products > Lineup > Molding Compounds for Semiconductor Encapsulation |
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Molding Compounds for Semiconductor Encapsulation |
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| Kyocera chemical's molding compounds have undergone extensive R&D testing in order to develop the most advanced technological materials. These are currently being used in wide-ranging semiconductor applications. Our product lineup is ideal for use in environments requiring halogen-free technology, for customers targeted use for Pb-free packages and for high temperature storage environments. A high level of reliability can be expected from our molding compounds. |
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| Molding Compounds for Laminate Packages |
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 Good filling characteristics, high Tg resins for packages that produce minimum warpage and high reliability. |
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· Environmentally Friendly Type
· Standard (Br/Sb) Type |
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| Molding Compounds for Surface Mount Devices |
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 Ideal for Pb-free solder that requires high reflow temperatures, especially suitable for Alloy 42, copper, Pd/Au plated frames. |
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· Environmentally Friendly Type
· Standard (Br/Sb) Type |
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| Molding Compounds for Small Signal Packages |
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 EMC with good productivity for TO-92 devices. We have a broad lineup that is suitable for very small package types, and is able to meet the needs of our customers.
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· For Surface Mount Devices
· For Insertion Devices |
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| Molding Compounds for General Packages |
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 can provide superior reliability for encapsulation of semiconductor packages, and for coil applications used in electronics devices,.
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· Standard Low Stress Type
· High Tg and Low Stress Type
· Environmentally Friendly Type |
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| Molding Compounds for Power Devices |
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 We can provide ideal EMC and also the ability to have high moisture resistance for power transistors that need high heat dissipation. |
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· High Thermal Conductivity Type |
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