Molding Compounds for Laminate Packages

With our compounds' high glass transition temperature characteristic, we can provide ideal warpage solutions.

Our compounds are also applicable to fine pitch wire bonding packages; with a wide lineup of non flame-retardant and flame–retardant-free compounds.

·KE-G1200 (KE-G2200)Series
·KE-G1250 (KE-G2250)Series
·KE-G1270 (KE-G2270)Series(pdf/79KB)
(Low a ray Type)

Our compounds are also applicable to fine pitch wire bonding packages. Our compounds excellent moldability provide customers with stable and high productivity.

·KE-1100A (KE-2100A)Series
·KE-1150 (KE-2150)Series(pdf/79KB)
(Low a ray Type)