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Products > Lineup > Molding Compounds for Semiconductor Encapsulation > Molding Compounds for Laminate Packages  Japanese

Molding Compounds for Laminate Packages

 
Environmentally Friendly Type | Standard (Br/Sb) Type

 Environmentally Friendly Type

With our compounds' high glass transition temperature characteristic, we can provide ideal warpage solutions.

Our compounds are also applicable to fine pitch wire bonding packages; with a wide lineup of non flame-retardant and flame–retardant-free compounds.

·KE-G1200 (KE-G2200)Series
·KE-G1250 (KE-G2250)Series
·KE-G1270 (KE-G2270)SeriesPDF(pdf/79KB)
(Low a ray Type)


 Standard (Br/Sb) Type
With our compounds' high glass transition temperature characteristic, we can provide ideal warpage solutions.

Our compounds are also applicable to fine pitch wire bonding packages. Our compounds excellent moldability provide customers with stable and high productivity.

·KE-1100A (KE-2100A)Series
·KE-1150 (KE-2150)SeriesPDF(pdf/79KB)
(Low a ray Type)


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Environmentally Friendly Products
Weight Reduction
Heat Resistance
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