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Products > Lineup > Molding Compounds for Semiconductor Encapsulation > Molding Compounds for Laminate Packages  Japanese

Molding Compounds for Laminate Packages

 
Environmental Friendly type | Standard(Br/Sb) type

 Environmental Friendly type

With our compound's high glass transition temperature characteristic, we can provide good warpage solution.
Our compound also applicable to fine pitch wire bonding package with wide line up of no frame retardant used and replaced flame retardant used compound.

·KE-G1200 (KE-G2200)Series
·KE-G1250 (KE-G2250)Series
·KE-G1270 (KE-G2270)SeriesPDF(pdf/79KB)
(Low a ray Type)


 Standard(Br/Sb) type
With our compound's high glass transition temperature characteristic, we can provide good warpage solution.
Our compound also applicable to fine pitch wire bonding package. Our compound excellent moldability provide customer stable and high production yield rate.

·KE-1100A (KE-2100A)Series
·KE-1150 (KE-2150)SeriesPDF(pdf/79KB)
(Low a ray Type)

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 Applications
Semiconductors
Automobile Parts
Office Automation Equipments

 Design Purpose
Environment-Preserving Products
Weight Reduction
Heat-Resistance
High Density Assembly
   
 
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