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Products > Lineup > Molding Compounds for Semiconductor Encapsulation > Molding Compounds for Power Devices  Japanese

Molding Compounds for Power Devices

 

 High Thermal Conductivity Type
Our high thermal conductivity series of compounds has excellent performance in terms of moldability, moisture resistance and low stress.

We have an excellent track record for isolation packages such as TO220, TO-3P and many other types where higher heat dissipation is required.

·KE-850 Series
·KE-870 Series
·KE-880 SeriesPDF(pdf/46KB)


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