Skip to main content Go to KYOCERA Chemical HOME KYOCERA Chemical Global THE NEW VALUE FRONTIER
Home      News      Products      About   
Product List Product System
Products
Lineup
Molding Compounds for Semiconductor Encapsulation
Molding Compounds for Laminate Packages
Molding Compounds for Surface Mount Devices
Molding Compounds for Small Signal Packages
Molding Compounds for General Packages
Molding Compounds for Power Devices
Molding Compounds
Functional Materials
Printed Circuit Board Materials
Chemical Engineering Materials
Molded Products
Molding Dies
Applications
Design Purpose
KYOCERA Corporation
Products > Lineup > Molding Compounds for Semiconductor Encapsulation > Molding Compounds for Power Devices  Japanese

Molding Compounds for Power Devices

 

 High Thermal Conductivity type
High Thermal Conductive series of compounds with excellent performance in term of moldability, moisture resistance and low stress.
Excellent track record for isolation package such as TO220, TO-3P and many other type of packages, where higher heat dissipation is required.

·KE-850 Series
·KE-870 Series
·KE-880 SeriesPDF(pdf/46KB)

Inquiries about product

 Applications
Semiconductors
Automobile Parts
Office Automation Equipments
   
 
Top of page
Products > Lineup > Molding Compounds for Semiconductor Encapsulation > Molding Compounds for Power Devices 
Contact      Terms of use      Privacy      Sitemap     
Copyright KYOCERA Chemical Corporation