Skip to main content Go to KYOCERA Chemical HOME KYOCERA Chemical Global THE NEW VALUE FRONTIER
Home      News      Products      About      Contact   
Products
Lineup
Molding Compounds for Semiconductor Encapsulation
Molding Compounds for Laminate Packages
Molding Compounds for Surface Mount Devices
Molding Compounds for Small Signal Packages
Molding Compounds for General Packages
Molding Compounds for Power Devices
Molding Compounds
Functional Materials
Chemically Engineered Materials
Molded Products
Applications
Design Purpose
External site KYOCERA Corporation (Global Web Site)
Products > Lineup > Molding Compounds for Semiconductor Encapsulation > Molding Compounds for Small Signal Packages    Japanese  

Molding Compounds for Small Signal Packages

 
 For Surface Mount Devices
Our molding compounds have excellent moldability for super small packages. Also, our compounds have high reflow ability to meet Pb-free reflow temperature.

·KE-520 Series
·KE-300F Series(pdf/75KB)PDF
 
 For Insertion Devices
With excellent molding yield rate and lower cost, our compounds are able to help customers save on total cost

·KE-300K Series(pdf/75KB)PDF
   
 
Products > Lineup > Molding Compounds for Semiconductor Encapsulation > Molding Compounds for Small Signal Packages 
Contact      Terms of use      Privacy      Sitemap     
Copyright KYOCERA Chemical Corporation