| For Surface Mount Devices |
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Our molding compounds have excellent moldability for super small packages. Also, our compounds have high reflow ability to meet Pb-free reflow temperature.
·KE-520 Series
·KE-300F Series (pdf/75KB) |
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| For Insertion Devices |
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With excellent molding yield rate and lower cost, our compounds are able to help customers save on total cost
·KE-300K Series(pdf/75KB) |
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Japanese
