| For Surface Mount Device |
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Our molding compound has excellent moldability for super small package.
- And our compound also has high reflow ability to meet Pb Free reflow temperature.
·KE-520 Series
·KE-300F Series (pdf/75KB) |
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| For Insertion Devices |
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With excellent molding yield rate and lower cost, our compound able to help customer to save cost in total.
·KE-300K Series(pdf/75KB) |
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Japanese
