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Molding Compounds for Semiconductor Encapsulation
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Molding Compounds for Surface Mount Devices
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Products > Lineup > Molding Compounds for Semiconductor Encapsulation > Molding Compounds for Surface Mount Devices    Japanese  

Molding Compounds for Surface Mount Devices

 
 Environmentally Friendly Type
Non-flame retardant type EMCs that satisfy UL94V-0 requirements for high solder resistance and top class industry. Also available for good storage temperature for devices.

·KE-G3000 Series
·KE-G3400 Series
·KE-G280 Series(pdf/53KB)PDF
 
 Standard (Br/Sb) Type
For countermeasures against high reflow temperatures of Pb-free solder. For good cost performance and high solder reflow temperature resistance.

·KE-200D Series
·KE-320D Series(pdf/89KB)PDF
   
 
Products > Lineup > Molding Compounds for Semiconductor Encapsulation > Molding Compounds for Surface Mount Devices 
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