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Molding Compounds for Semiconductor Encapsulation
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Products > Lineup > Molding Compounds for Semiconductor Encapsulation > Molding Compounds for Surface Mount Devices  Japanese

Molding Compounds for Surface Mount Devices

 
Environmental Friendly type | Standard(Br/Sb) type

 Environmental Friendly type
No flame retardant type EMC that satisfy UL94V-0 requirements. For high solder resistivity and for top class industry. It is possible for good storage temperature for devices.

·KE-G3000 Series
·KE-G3400 Series
·KE-G280 SeriesPDF(pdf/53KB)

 Standard(Br/Sb) type
For countermeasures against high reflow temperatures of Pb free solder. For good cost performance and high solder reflow temperature resistivities.

·KE-200D Series
·KE-320D SeriesPDF(pdf/89KB)

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 Applications
Semiconductors
Automobile Parts
Office Automation Equipments

 Design Purpose
Environment-Preserving Products
Weight Reduction
Heat-Resistance
   
 
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