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Products > Lineup > Printed Circuit Board Materials > FPC Materials  Japanese

FPC Materials

 
Flexible Copper Clad Laminate | Coverlay (Cover Film) | Bonding Sheet

   
 Flexible Copper Clad Laminate
TLF-521 Series is polyimide based flexible copper clad laminate, which have the well-balance characteristics, in addition to excellent folding endurance.
UL MOT (Max Operating Temperature) : 105°C. UL94 recognition : V-0

·TLF-521 Series(pdf/192KB)PDF

 Coverlay (Cover Film)
TFA-577 Series is polyimide based covelay, which shows the well-balance characteristics, in addition to excellent folding endurance, by combining with flexible copper clad laminate "TLF-521 Series".

·TFA-577 Series(pdf/130KB)PDF

 Bonding Sheet
TFA-880 Series is sheet adhesive, which is used to bond flexible inner layers or rigid cap layers in multilayers, as well as to bond stiffeners. We can offer various sheet adhesive such as "TFA-880CA" with excellent insulation resistance and "TFA-880CE" with outstanding adhesive property and excellent thermal resistance.

·TFA-880 Series(pdf/131KB)PDF

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 Applications
Circuit and Electronic Components
Automobile Parts
Office Automation Equipments

 Design Purpose
High Density Assembly
   
 
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