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Products > Lineup > Printed Circuit Board Materials > FPC Materials  Japanese

FPC Materials

 
Flexible Copper Clad Laminates | Coverlays (Cover Films) | Bonding Sheets

   
 Flexible Copper Clad Laminates

The TLF-521 Series polyimide based flexible copper clad laminates possess well-balanced characteristics in addition to excellent folding endurance.


UL MOT (Max Operating Temperature): 105°C

UL94 recognition: V-0

·TLF-521 Series(pdf/192KB)PDF


 Coverlays (Cover Films)
The TFA-577 Series polyimide based covelays show well-balanced characteristics in addition to excellent folding endurance by combining with the TLF-521 Series flexible copper clad laminates.

·TFA-577 Series(pdf/130KB)PDF

 Bonding Sheets
The TFA-880 Series sheet adhesives are used to bond flexible inner layers or rigid cap layers in multilayers, as well as to bond stiffeners. We offer various sheet adhesives such as the TFA-880CA with excellent insulation resistance and TFA-880CE with outstanding adhesive property and excellent thermal resistance.

·TFA-880 Series(pdf/131KB)PDF

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Circuit and Electronic Components
Automotive Components
Office Automation Equipment

 Design Purpose
High Density Assembly
   
 
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