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Products > Lineup > Printed Circuit Board Materials > Heat-Resistant Halogen-Free FPC Materials  Japanese

Heat-Resistant Halogen-Free FPC Materials

Flexible Copper Clad Laminates | Coverlays (Cover Films) | Bonding Sheets

   
 Flexible Copper Clad Laminates
The TLF-530 Series are polyimide film based flexible laminates with easy handling. Through the development of halogen/antimony-free adhesive, the two are remarkable improvement on the current product.

·TLF-530 Series(pdf/435KB)PDF

 Coverlays (Cover Films)
The TFA-560 Series coverlays have excellent specific characteristics including thermal resistance, insulation resistance, chemical resistance and folding endurance.

·TFA-560 Series(pdf/129KB)PDF

 Bonding Sheets
The TFA-890 Series halogen free bonding sheets have outstanding reliability in migration resistance required for flex-rigid.

·TFA-890 Series(pdf/110KB)PDF

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High Density Assembly
   
 
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