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Products > Lineup > Printed Circuit Board Materials > Heat-Resistance Halogen-free FPC Materials  Japanese

Heat-Resistance Halogen-free FPC Materials

Flexible Copper Clad Laminate | Coverlay (Cover Film) | Bonding Sheet

   
 Flexible Copper Clad Laminate
TLF-530 Series which is polyimide film based flexible laminate with easy handling, are available. By developed halogen/antimony-free adhesive, the two are remarkable improvement on the current product.

·TLF-530 Series(pdf/435KB)PDF

 Coverlay (Cover Film)
TFA-560 Series is almighty coverlay, which has excellent specific characteristic in all respects, such as thermal resistance, insulation resistance, chemical resistance and folding endurance.

·TFA-560 Series(pdf/129KB)PDF

 Bonding Sheet
TFA-890 Series is halogen free bonding sheet, which has the outstanding reliability in migration resistance required for flex-rigid, and has important achievement to its credit in this field.

·TFA-890 Series(pdf/110KB)PDF

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 Applications
Circuit and Electronic Components
Automobile Parts
Office Automation Equipments

 Design Purpose
High Density Assembly
   
 
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