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Molding Compounds for Semiconductor Encapsulation
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Molding Compounds for Laminate Packages
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Molding Compounds for Surface Mount Devices
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Molding Compounds for Small Signal Packages
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Molding Compounds for General Packages
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Molding Compounds for Power Devices
Molding Compounds
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Phenolic Molding Compounds (TECOLITE)
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Epoxy Molding Compounds
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Unsaturated Polyester Molding Compounds (Premix)
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Thermosetting Polyimide Resin (IMIDALLOY)
Functional Materials
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Electric Conductive Pastes
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Anisotropic Conductive Pastes
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Heat-Resistance Passivation Materials
Printed Circuit Board Materials
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Super Series FPC Materials
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Heat-Resistance Halogen-free FPC Materials
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FPC Materials
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Thermosetting PPE Printed Circuits Board Materials
Chemical Engineering Materials
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Insulating Varnishes
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Casting Resin
Molded Products
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Magnesium-Molded Parts
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Plastic Molded Parts
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Thermosetting Molded Parts
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Pultrusion Molded Parts
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TC Boards
Molding Dies
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Product Information
Applications
Semiconductors
Circuit and Electronic Components
Automobile Parts
Office Automation Equipments
Power and Energy Fields
Healthy Life Relation / Physics and Chemistry
Design Purpose
Environment-Preserving Products
Weight Reduction
Heat-Resistance
High Density Assembly
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