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Molding Compounds for Semiconductor Encapsulation
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Molding Compounds for Laminate Packages
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Molding Compounds for Surface Mount Devices
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Molding Compounds for Small Signal Packages
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Molding Compounds for General Packages
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Molding Compounds for Power Devices
Molding Compounds
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Phenolic Molding Compounds (TECOLITE)
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Epoxy Molding Compounds
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Unsaturated Polyester Molding Compounds (Premix)
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Thermosetting Polyimide Resins (IMIDALLOY)
Functional Materials
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Electric Conductive Pastes
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Anisotropic Conductive Pastes
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Heat-Resistant Passivation Materials
Chemically Engineered Materials
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Insulating Varnishes
(Impregnation Resin)
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Casting Resins
Printed Circuit Board Materials
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Heat-Resistant Halogen-free FPC Materials
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FPC Materials
Molded Products
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Magnesium-Molded Parts
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Plastic Molded Parts
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Thermosetting Molded Parts
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Pultrusion Molded Parts
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TC Boards
Applications
Semiconductors
Circuit and Electronic Components
Automotive Components
Office Automation Equipment
Energy Sector
Lifestyle / Physics / Chemistry
Design Purpose
Environmentally Friendly Products
Weight Reduction
Heat Resistance
High Density Assembly
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